Hardware · Updated 18 Oct, 07:20 pm IST
Samsung to use TSMC 3nm process for Nvidia's next-gen HBM base dies
Why it matters for readers: It explains why companies sometimes use another firm's chipmaking process to meet specific product needs.
- Samsung will use TSMC's 3nm process to produce base dies for Nvidia's next‑generation custom HBM chips.1
- Nvidia requested Samsung, SK Hynix and Micron to adopt TSMC's process for NVHBM base dies and 6th‑generation DRAM for core dies.1
- NVHBM integrates Nvidia's custom memory controller into the base die and aims to standardise implementation across multiple memory suppliers.1
- Samsung accepted Nvidia's requirements after an internal review but will keep in‑house production for standard HBM and other custom products.1
- Samsung is evaluating whether its own foundry could produce NVHBM base dies if demand exceeds TSMC capacity.1
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